High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

TS-TIF^®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.

Features:

>Excellent thermal conductivity 8.0W/mK

>Self-adhesive without the need for additional surface adhesive
>Highly compressible, soft, and elastic

>Available in various thicknesses
>Good chemical stability

Applications:

>CPU and GPU processors and other chipsets
>High-performance computing (HPC)

>Industrial equipment
>Network communication devices

>New energy vehicles

Dongguan Ziitek Electronical Material and Technology Ltd.  provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Ziitek D-U-N-S® Number: 656191068