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Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry

    Buy cheap Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry from wholesalers
     
    Buy cheap Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry from wholesalers
    • Buy cheap Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry from wholesalers
    • Buy cheap Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry from wholesalers

    Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TS-TIR700-25
    Certification : RoHS
    Price : 0.1-10USD/pcs
    Payment Terms : T/T
    Supply Ability : 100000pcs/month
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry

    Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry

    Company profile


    Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    Products introduction
    TS-TIR®700-25 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.


    Feature

    >Good thermal conductivity 25w/mK

    >Ultra-low thermal resistance
    >works under low pressure.

    >Non-insulating material with electrical conductivity

    >Non-adhesive surface


    Application

    >Between chips and heat dissipation modules

    >5G communication equipment
    >Optoelectronics industry

    >wearable devices

    Typical Properties of TIR®700-25 series
    Product NameTIR®700-25Test Method
    ColourGrayVisual
    ConstructionCarbon fiber filled silicone*****
    Thickness range0.01"~0.04" (0.3~1.0 mm)0.06"~0.20"(1.5~5.0 mm)ASTM D374
    Hardness75±10 Shore 0055±10 Shore 00ASTM D2240
    Density2.9g/cm3ASTM D792
    Operation Temperature-40℃~ 200℃******
    Thermal impedance25.0W/m-KASTM D5470
    Specific heat capacity (J/g ℃)0.75ASTM E1269 @25℃
    Flame RatingV-0UL94
    RoHSCompliantIEC62321

    Product Specification
    Standard Thickness:0.01" (0.3mm), 0.02"(0.5mm), 0.04"(1.0mm), 0.06" (1.5mm), 0.08" (2.0mm), 0.10" (2.5mm), 0.12" (3.0mm)

    Standard Size: 1.97"×1.97"(50.0mm x 50.0mm)

    Packaging Details & Lead time

    1.with PET film or foam-for protection
    2. use Paper Card To Separate Each Layer
    3. export carton inside and outside
    4. meet with customers' requirement-customized

    Lead Time :Quantity(Pieces):5000
    Est. Time(days): To be negotiated


    Independent R&D team


    Q: How do I place an order?

    A:1. Click the "Sent messages" button to continue with the process.

    2. Fill out the message form by entering a subject line, and message to us.

    This message should include any questions you might have about the products as well as your purchase requests.

    3. Click the "Send" button when you are finished to complete the process and send your message to us

    4. We will reply you as soon as possible with Email or online.

    Quality Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry for sale
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