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High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks

    Buy cheap High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks from wholesalers
     
    Buy cheap High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks from wholesalers
    • Buy cheap High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks from wholesalers
    • Buy cheap High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks from wholesalers

    High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF100 6045-62
    Certification : UL & RoHS
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks

    High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks


    Company Profile


    With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    TIF®100 6045-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.


    Features:
    > Excellent thermal conductivity 6.0W/mK

    > Naturally tacky needing no further adhesive coating
    > High compliance adapts to various pressure application environments
    > Easy release construction
    > Electrically isolating
    > High durability


    Applications:
    > Heat dissipation structure for radiators

    > Telecommunication equipment
    > Automotive electronics
    > Battery packs for electric vehicles

    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware

    Typical Properties of TIF®100 6045-62 Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.4g/ccASTM D792
    thickness0.020"(0.5mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)45 (Shore 00)ASTM 2240
    Continuos Use Temp-40 to 200℃******
    Dielectric Breakdown Voltage≥5000 VACASTM D149
    Dielectric Constant6.0MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0

    UL94(E331100)

    Thermal conductivity6.0W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)


    Consult the factory to alternate thickness.


    Product Specification
    Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments of 0.01(0.25mm)
    Product Sizes:16" x 16"(406mm x406mm)
    Component Codes:
    Reinforcement Fabric: FG (Fiberglass).
    Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
    Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
    Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
    The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.
    High Strength 6.0W Electrically Insulating Pad Thermal Pad For Electronic Components Heat Sinks

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated.


    FAQ:

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.


    Q: How do I place an order?

    A:1. Click the "Sent messages" button to continue with the process.

    2. Fill out the message form by entering a subject line, and message to us.

    This message should include any questions you might have about the products as well as your purchase requests.

    3. Click the "Send" button when you are finished to complete the process and send your message to us

    4. We will reply you as soon as possible with Email or online

    Q: How do I request customized samples?

    A: To request samples, you can leave us message on website, or just contact us by send email or call us.


    Q: What's the thermal conductivity test method given on the data sheet ?

    A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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