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3.0W/M.K One-Component Thermal Putty Thermal Conductive Gel For Battery Power Silicone Interface Materials

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Dongguan Ziitek Electronical Material and Technology Ltd.

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3.0W/M.K One-Component Thermal Putty Thermal Conductive Gel For Battery Power Silicone Interface Materials

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Brand Name :	Ziitek
Model Number :	TIF030-05
Certification :	UL
Price :	0.1-100USD/KG
Payment Terms :	T/T
Supply Ability :	10000KG/MONTH
Delivery Time :	3-8 WORK DAYS

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3.0W/M.K One-Component Thermal Putty Thermal Conductive Gel For Battery Power Silicone Interface Materials

3.0W/mK One-Component Thermal Putty Thermal Conductive Gel For Battery Power Silicone Interface Materials

TIF^®030-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF^®030-05 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular Isilicon chips, LED lighting, and other high-power electronic components.

3.0W/M.K One-Component Thermal Putty Thermal Conductive Gel For Battery Power Silicone Interface Materials

Feature

>Thermal conductivity: 3.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically
>Proven long-term reliability

Application

>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment

TIF^®030-05 Typical Properties
Property	Value	Test method
Color	Blue	Visual
Construction & Composition	Ceramic filled silicon material	-
Flow Rate(g/min)	30	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Flow Rate(g/min)	30	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc)	3.25g/c	ASTM D297
Thermal conductivity	3.0W/mK	ASTM D5470
Thermal Impedance @10psi (℃.in²w)	0.08	ASTM D5470
Thermal Impedance @50psi (℃.in²w)	0.075	ASTM D5470
Recommended Operating Temp	-45 ~200°C	Ziitek Test Method
Dielectric Strength(V/mm)	≥4000	ASTM D149
Bond Line Thickness(mm)	0.1	Ziitek Test Mothod
Flame Rating	V-0	UL 94
Shelf Life	12 months	-

Product Specification:

30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Q&A:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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