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High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram

Dongguan Ziitek Electronical Material and Technology Ltd.
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    Buy cheap High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram from wholesalers
     
    Buy cheap High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram from wholesalers
    • Buy cheap High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram from wholesalers
    • Buy cheap High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram from wholesalers

    High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TIF100-12-66U Series
    Certification : RoHS and UL recognized
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 1000000 pcs/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram

    High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram


    Company Profile


    Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    Product description


    TIF100-12-66U Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


    Features


    > Good thermal conductive : 1.2W/mK
    > Soft and Compressible for low stress applications
    > Naturally tacky needing no further adhesive coating
    > Available in varies thickness

    > Easy release construction
    > Electrically isolating
    > High durability


    Applications


    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Display card
    > Telecommunication hardware
    > Audio and video components
    > IT infrastructure
    > GPS navigation and other portable devices


    Typical Properties of TIF100-12-66U Series
    ColorGreenVisual
    Construction & CompostionCeramic filled silicone elastomer*******
    Specific Gravity2.1g/ccASTM D297
    Thickness range0.010"(0.25mm)~0.200" (5.0mm)ASTM C351
    Hardness (thickness ≥1.0mm)27±5 Shore 00ASTM 2240
    Dielectric Breakdown Voltage>5500 VACASTM D412
    Operating Temp-40 ~160℃*******
    Dielectric Constant4.0 MHzASTM D150
    Volume Resistivity1.0X1012Ohm-meterASTM D257
    Fire rating94-V0equivalent UL
    Thermal conductivity1.2W/mKASTM D5470

    Product Specification


    Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

    Product Sizes: 8" x 16"(203mm x406mm)

    Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.

    Safe disposal method does not require special protection.The storage condition is low temperature and dry,

    away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

    High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated.


    FAQ:


    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.


    Q: How long is your delivery time?

    A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


    Q: Do you provide samples ? is it free or extra cost?

    A: Yes, we could offer samples free of charge


    Ziitek Culture


    Quality :

    Do it right the first time, total quality control

    Effectiveness:

    Work precisely and thoroughly for effectiveness

    Service:

    Quick response, On time delivery and Excellent service

    Team work:

    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

    High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram

    Quality High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Cpu Gpu Ram for sale
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