High Quality Ultra Soft High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Ziitek TIF^®100-05S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-05S is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Features

> Good thermal conductive: 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power

Dongguan Ziitek Electronical Material and Technology Ltd.  provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Ziitek D-U-N-S® Number: 656191068