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Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT

    Buy cheap Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT from wholesalers
     
    Buy cheap Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT from wholesalers
    • Buy cheap Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT from wholesalers
    • Buy cheap Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT from wholesalers

    Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT

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    Brand Name : Ziitek
    Model Number : TIF160-30-11US thermal pad
    Certification : UL
    Price : 0.1-10 USD/PCS
    Payment Terms : T/T
    Supply Ability : 100000pcs/month
    Delivery Time : 3-8 work days
    • Product Details
    • Company Profile

    Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT

    High cost-effective thermal gap pad for Mass storage devices ,20±5 shore00,1.5mmT


    Company Profile

    With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


    TIF100-30-11US-Series-Datasheet-.pdf

    TIF160-30-11US is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling Ziitek TIF160-30-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. Ziitek TIF160-30-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request
    Features
    <Good thermal conductive:3.0W/mK
    <Thickness:1.5mmT
    <Hardness:20±5 Shore 00
    <Colour: gray

    <Fiberglass reinforced for puncture, shear and tear resistance

    <Easy release construction

    Applications

    <Mass storage devices

    <Automotive electronics

    <Set top boxes

    <Micro heat pipe thermal solutions

    <Automotive engine control units

    <Telecommunication hardware


    Typical Properties of TIF160-30-11US
    Product Name

    TIF160-30-11US Series

    Colour
    gray
    Construction & Compostion
    Ceramic filled silicone elastomer

    Specific gravity

    3.0 g/cc

    Thickness

    1.5mmT
    Hardness
    20±5Shore 00
    Dielectric constant@1MHz
    4.0 MHz
    Continuos Use Temp
    -40to 160℃
    Dielectric Breakdown Voltage
    >5500 VAC
    Thermal conductivity
    3.0W/mK
    Volume Resistiviyt

    1.0*1012 Ohm-cm

    Peressure Sensitive Adhesive:

    Request adhesive on one side with "A1" suffix.

    Request adhesive on double side with "A2" suffix.


    Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract

    5.Free sample offer

    6.Quality assurance contract


    FAQ

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China


    Q: What's the thermal conductivity test method given on the data sheet ?

    A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

    Quality Thermal Gap Pad For Mass Storage Devices ,20±5 Shore00,1.5mmT for sale
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